Reflecting on an inspiring week at IEEE ESTC 2026 in Helsinki

With 470 participants from 31 countries, IEEE ESTC 2026 was the largest edition of the conference to date. The three-day event brought together experts from industry, academia and research for an inspiring exchange on the future of electronics packaging and system integration.
The programme featured a comprehensive mix of technical sessions, keynote presentations, professional development courses, special sessions, poster presentations and an exhibition with 37 exhibitors.
Additional highlights included the Heterogeneous Integration Roadmap workshop, a panel discussion on sustainability, student activities and countless valuable discussions throughout the conference.

For TELTEC, ESTC was a great opportunity to exchange views on current developments in BEOL solutions. Different manufacturers presented technologies for advanced electronics packaging, with a particular focus for us on solutions from TAZMO INC. and Okamoto Machine Tool Europe GmbH.
Thank you to the organisers, exhibitors, speakers, customers and partners who made IEEE ESTC 2026 such a successful and internationally connected event. We look forward to continuing the conversations started in Helsinki.